BAS3010B... Medium Power AF Schottky Diode • Forward current: 1 A • Reverse voltage: 30 V • Low forward voltage, low reverse current • For high efficiency DC/DC conversion, fast switching, protection and clamping applications • Pb-free (RoHS compliant) package1) • Qualified according AEC Q101 BAS3010B-03W (cid:1) (cid:2) Type Package Configuration Marking BAS3010B-03W SOD323 single 2/ red Maximum Ratings at T = 25°C, unless otherwise specified A Parameter Symbol Value Unit Diode reverse voltage2) V 30 V R Forward current2) I 1 A F Average rectified forward current (50/60Hz, sinus) I 1 FAV Repetitive peak forward current I 3.5 FRM (t ≤ 1 ms, D ≤ 0.5) p Non-repetitive peak surge forward current I 10 FSM (t ≤ 10 ms) Junction temperature T 150 °C j Operating temperature range T -65 ... 125 op Storage temperature T -65 ... 150 stg 1Pb-containing package may be available upon special request 2 For T > 25°C the derating of V and I has to be considered. Please refer to the attached curves. A R F 1 2007-04-19

BAS3010B... Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) R ≤ 82 K/W thJS Electrical Characteristics at T = 25°C, unless otherwise specified A Parameter Symbol Values Unit min. typ. max. DC Characteristics Reverse current2) I µA R V = 5 V - - 5 R V = 10 V - - 10 R V = 30 V - - 20 R Forward voltage2) V mV F I = 1 mA - 230 280 F I = 10 mA - 300 350 F I = 100 mA - 360 420 F I = 500 mA - 420 480 F I = 1 A - 480 550 F AC Characteristics Diode capacitance C - 33 40 pF T V = 5 V, f = 1 MHz R 1For calculation of R please refer to Application Note Thermal Resistance thJA 2Pulsed test: t = 300 µs; D = 0.01 p 2 2007-04-19

BAS3010B... Diode capacitance C = ƒ (V ) Reverse current I = ƒ (T ) T R R A f = 1MHz V = Parameter R 10 -2 120 A pF 10 -3 80 CT R 10 -4 I 60 10 -5 VR = 30 V 20 V 40 10 V 5 V 10 -6 20 0 10 -7 0 5 10 15 20 V 30 0 25 50 75 100 °C 150 V T R A Reverse current I = ƒ(V ) Forward Voltage V = ƒ (T ) R R F A T = Parameter I = Parameter A F 10 -2 0.6 A V 10 -3 0.5 IF = 1 A 500 mA TA = 125 °C 100 mA 0.45 10 mA IR 10 -4 VF 0.4 TA = 85 °C 0.35 10 -5 0.3 0.25 10 -6 TA = 25 °C 0.2 0.15 10 -7 0.1 0 5 10 15 20 V 30 -50 -25 0 25 50 75 100 °C 150 V T R A 3 2007-04-19

BAS3010B... Forward current I = ƒ (V ) Permissible Reverse voltage V = ƒ (T ) F F R A t = Parameter, Duty cycle < 0.01 p Device mounted on PCB with Rth = 160 k/W 10 0 35 A tp=300µs V 10 -1 tp=100ms x 25 a m R F V I 20 10 -2 DC 125 °C 15 85 °C 25 °C -40 °C 10 10 -3 5 10 -4 0 0 0.1 0.2 0.3 0.4 V 0.6 0 25 50 75 100 °C 150 V T F A Forward current I = ƒ (T ) F S 1200 mA 800 F I 600 400 200 0 0 15 30 45 60 75 90 105 120 °C 150 T S 4 2007-04-19

Package SOD323 BAS3010B... Package Outline 0.9+0.2 -0.1 1.25-+00..12 0±0.05 A 2 5 5±0.2 mCaatrhkoindge 5±0.1 +0.27-0.1 2. 0.4 1. 1 0.3+0.1 0.3+0.05 -0.05 -0.2 0.15+0.1 0.25M A -0.06 Foot Print 8 0. 7 1. 8 0. 0.6 Marking Layout (Example) BAR63-03W Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 4 0.2 22.98 Cathode 0.65 1 marking 1.35 5 2007-04-19

BAS3010B... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2007-04-19

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